The Reliability Analysis and Structure Design for the Fine Pitch Flip Chip BGA Packaging

. Graduate Assistant, Ph.D candidate 2 . Corresponding Author, Professor, Dept. of Power Mechanical Engineering, National Tsing Hua University Abstract The flip chip packaging structure design and the fabrication process parameters will influence the packaging reliability and the performance of chip heat dissipation. The reliability of a flip chip package depends on the packaging structure design parameters, which include solder bump geometry, die side pad and substrate side pad dimensions, etc. In order to study the effects of bonding pad size and solder bump geometry for the flip chip packaging reliability, three different structures of the fine pitch flip chip BGA packages including daisy chain circuit are designed, fabricated and tested in this investigation for the parametric analysis. Subsequently, the analytical solution analyzing technique for solder joint shape prediction is employed in this study for the preliminary prediction of package reliability. Furthermore, a finite element method (FEM) is also applied for the packaging reliability analysis. The findings depict that the packaging structure with better solder bump shape shows better reliability, and the trends of reliability testing and FEM results coincide with the analytical solution of the solder shape prediction.